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Testing & Packaging Engineer - Final Testing

Job Type : Full-Time
Location : Hsinchu (Taiwan)
Post Date : 2023/03/01

Summary :
Roles & Responsibilities:
  • FT ATE 測試程式撰寫與開發
  • FT 量產導入與維護、良率分析
  • 新產品導入時提供初步測試規劃、協調電路測試製作(Dut Board/ Load Board/ Probe Card)及執行驗證測試
  • 與封測廠發生異常或開發技術問題時溝通、協調能力,與團隊合作制定解決方案

Requirements & Qualifications:

Basic Qualifications:

  • 碩士學歷,電子電機科系為主
  • 2年以上工作經驗
  • 了解IC晶圓製作流程
  • IC產品特性協調測試計畫並協助測試系統開發 (尤其是類比IC)
  • CIS產品研發測試經驗
  • 產品導入時提供初步測試規劃、電路測試製作與驗證測試
  • 測試文件撰寫與管理
  • 試產及量產時的產品異常分析與改善
  • 新產品導入(NPIE) 及良率改進
  • 協助評估IC測試外包廠及測試軟硬體設備
  • 具備與封測廠合作、溝通經驗 

Preferred Qualifications:

  • 具量測儀器編程能力(Labview, python, C++...)
  • 具有基礎光學量測經驗
  • 具有IC 封裝測試等相關經驗

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