OmniVision and Artilux announce collaboration on NIR 3D imaging and more
OmniVision, an industry leading developer of high performance CMOS image sensor solutions, and Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, jointly announced their execution of a formal letter of intent to collaborate in the field of CMOS image sensors and GeSi based 3D sensors, after a series of evaluation and analysis.
Unfolding new dimensions of CMOS SWIR imaging
Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.
Artilux announces new GeSi 3D sensing technology to improve eye safety and outdoor user experiences
Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform developed by Artilux in cooperation with TSMC.
Packaging Technical Manager for Optical Sensing Module
As a Packaging Technical Manager in ATLX, you will be responsible for the design of packaging solutions for an optical sensor product line. This position requires self-starters who can manage complex packaging designs from concept through release to production. You will work with a highly motivated team of engineering professionals and have personal responsibly to drive your designs through the process. This position requires working knowledge of all aspects of packaging and electromechanical design.