Job Type : Full-Time
Location : Hsinchu (Taiwan)
Post Date : 2024/04/10

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Summary :

As a Packaging Staff Engineer in ATLX, you will be responsible for the design of packaging solutions for an optical sensor product line. This position requires self-starters who can manage complex packaging designs from concept through release to production. You will work with a highly motivated team of engineering professionals and have personal responsibly to drive your designs through the process. This position requires working knowledge of all aspects of packaging and electromechanical design.

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Roles & Responsibilities：

• Manage development and test of custom packaging from concept to end of life.
• Create/review documentation in detail for packaging drawings, artwork, and bills of material.
• Strong design trouble shooting skills required for sustaining engineering/root cause analysis. Includes all sustaining activities for production, drawing up-dates as required.
• Work closely with purchasing, packaging suppliers and product manufacturers to ensure packaging designs are aligned with manufacturing processes and optimized for cost.
• Interact in a team environment with hardware engineering and manufacturing.
• Oversee and manage complete packaging development process, including design, prototype development, and performance testing.
• Support continuous improvement activities including redesigning, testing and implementing packaging for existing products for improved design and cost.
• Contribute to developing operating procedures, standardized practices, material specifications, and validation test methods.
• Responsibilities include writing specifications, sustaining production, and participating in overall module specifications.

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Requirements & Qualifications：

Basic Qualifications:

• BS degree in Electrical Engineering, Optics Engineering, equivalent, or better.
• 5 years above of work experience in the electronic/optical industry.
• Great knowledges and experiences of optical packaging (technologies, assembly processes, materials), as illustrated in the following
  • Very compact lens module design and packaging lid/cap design
  • Insertion molding and/or 2-shot molding of compact components
  • Glue design, selection, and glue bleeding control
  • Optical materials modeling, selection, and testing
  • Optical packaging (reliability) standards and FA techniques

Preferred Qualifications:

• Working experience in optical sensor packaging development.
• Working experience in OSAT management