enlighten the path from information to intelligence
EN
menu

Unfolding new dimensions of SWIR imaging

Turning scientific innovation into commercial applications, Aritlux has developed the world’s first single-chip GeSi CMOS-based and dual-mode (2D/3D) SWIR sensing technology at TSMC on 12-inch production line, and is ready for commercialization at scale.

World’s 1st and only provider for single-chip SWIR dual-mode (2D/3D) sensor for commercialization

Today, SWIR sensing is mostly based on GaAs or InP substrates and other III-V compound semiconductor, resulting in high cost especially with growing demand for larger array size, and growing difficulty to be integrated with CMOS-based circuity. With our proprietary and patented GeSi technology for SWIR 2D, 3D imaging and beyond, Artilux enables an ever-growing ecosystem to meet the market needs for a compact, ultra-sensitive, low power consumption, safe (lead-free), cost-competitiveness and mature SWIR all-in-one sensor.

Challenges Artilux has overcome

  • Ultra-sensitive and high-bandwidth photonic device technology
  • Energy efficient and scalable SWIR SoC architecture
  • Compact SWIR transmitter and integrated optics
  • Wide spectrum imaging pipeline and intelligent computing algorithms

The Infrared (IR) spectrum is placed between the visible and microwave regions, which spans from 0.75 to 12 micron (μm), and can be classified into 4 sub-bands: Near Infrared (NIR), Short Wave Infrared (SWIR), Mid Wave Infrared (MWIR), and Long Wave Infrared (LWIR).

Amplify SWIR capabilities with a GeSi-based CMOS ASIC (Application Specific Integrated Circuit) & imaging pipeline

  • HD Visual

    High accuracy and high resolution in different environments under low visibility (e.g., imaging in fog, imaging at night), unique recognition capability on specific object materials (e.g., plastics, stones, glass, etc.)

  • Scalability

    12 inch-foundry production, diversified product designs to meet a variety of needs

  • Compatibility

    Single chip with integrated edge AI computing capability in a compact, low power, and multi-functional design

  • Safety & Robustness

    Low risk to human eyes from laser exposure, less interference from sunlight and ambient noise

  • Cost Competitiveness

    Significant cost-saving of sensor over conventional III-V technology

This Site Uses Cookies

This website stores cookies on your computer. These cookies are used to collect information about how you interact with our website, which allow us to improve and customize your browsing experience and for analytics and metrics about our visitors on this website. By continuing to use this site, you agree to our use of cookies. To find out more, see our Cookie Policy.