Packaging Staff Engineer - Optical Sensing Module
As a Packaging Staff Engineer in ATLX, you will be responsible for the design of packaging solutions for an optical sensor product line. This position requires self-starters who can manage complex packaging designs from concept through release to production. You will work with a highly motivated team of engineering professionals and have personal responsibly to drive your designs through the process. This position requires working knowledge of all aspects of packaging and electromechanical design.
EE System Engineer and Chip Architect - Biometric Sensing
We are looking to hire a highly motivated engineer with a passion on technology research and development. Within Artilux's RD team, you will help deliver an ASIC system that powers our next generation of sensor products. You will provide great technical expertise to a group of hardware engineers in an innovative and fast-paced environment, with a focus on IC system design and verification. You will own and drive technical projects from the concept/planning stage through execution and closure.
II-VI Incorporated and Artilux Demonstrate a 3D Camera for Enhanced User Experience in the Metaverse
II‐VI Incorporated (Nasdaq: IIVI), a leader in semiconductor lasers, and Artilux, a leader in germanium silicon (GeSi) photonics and CMOS SWIR sensing technology, today announced a joint demonstration of a next-generation 3D camera with much longer range and higher image resolution to greatly enhances user experience in the metaverse.
Artilux presenting CMOS SWIR technology for brighter tomorrow at COMPUTEX 2022
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) technology, showcased in COMPUTEX 2022 a full range of products at Booth #N0605a of Taipei Nangang Exhibition Center, Hall 1 from May 24th to 27th. With diverse scenario demonstrations, Artilux gave visitors a glimpse into the vast opportunities in using CMOS SWIR technology to seamlessly integrate optical communication, sensing, and imaging into product solutions to transform users’ day-to-day interactions with people and machines. As a highlight, Artilux launched two new products, including a multi-spectrum all-in-one bio-sensor for TWS earbuds and other wearables to enable digital health, and a dual-band 3D camera with optimal depth-sensing capability in NIR and SWIR spectra that is poised to enhance user experience in FinTech security, smart agriculture and food inspection, metaverse, and many more applications.
Artilux unveils full product series at COMPUTEX 2022
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) technology, today announced that a full range of products will be showcased for the first time at the upcoming COMPUTEX 2022 between May 24th and 27th at Booth #N0605a in Taipei Nangang Exhibition Center, Hall 1. Customers, partners and visitors worldwide will have an opportunity to experience the infinite possibilities for realizing more diversified applications and a brighter future empowered by Arilutx smart sensing and imaging solutions on display at the booth.
Artilux Demonstrates New Breakthrough for Multi Spectral Optical Sensing
Artilux, the leader in CMOS-based SWIR optical sensing technology, demonstrated a multi-spectral optical sensing platform compatible with NIR/SWIR vertical-cavity surface-emitting laser (VCSEL) arrays, light emitting diodes (LED), and CMOS-based GeSi (Germanium-Silicon) sensors. This compact optical sensing platform is the industry-leading solution targeted to embrace the rapidly growing TWS and wearables markets in addition to unlock diversified scenarios in digital health.
OmniVision and Artilux announce collaboration on NIR 3D imaging and more
OmniVision, an industry leading developer of high performance CMOS image sensor solutions, and Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, jointly announced their execution of a formal letter of intent to collaborate in the field of CMOS image sensors and GeSi based 3D sensors, after a series of evaluation and analysis.
Unfolding new dimensions of CMOS SWIR imaging
Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.
Artilux announces new GeSi 3D sensing technology to improve eye safety and outdoor user experiences
Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform developed by Artilux in cooperation with TSMC.